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| MBRM140T3 Advance Information Surface Mount Schottky Power Rectifier POWERMITE(R) Power Surface Mount Package http://onsemi.com The Schottky Powermite employs the Schottky Barrier principle with a barrier metal and epitaxial construction that produces optimal forward voltage drop-reverse current tradeoff. The advanced packaging techniques provide for a highly efficient micro miniature, space saving surface mount Rectifier. With its unique heatsink design, the Powermite has the same thermal performance as the SMA while being 50% smaller in footprint area, and delivering one of the lowest height profiles, < 1.1 mm in the industry. Because of its small size, it is ideal for use in portable and battery powered products such as cellular and cordless phones, chargers, notebook computers, printers, PDAs and PCMCIA cards. Typical applications are ac/dc and dc-dc converters, reverse battery protection, and "Oring" of multiple supply voltages and any other application where performance and size are critical. Features: SCHOTTKY BARRIER RECTIFIER 1.0 AMPERES 40 VOLTS ANODE CATHODE PLASTIC CASE 457 * * * * * * * * * * * Low Profile -- Maximum Height of 1.1 mm Small Footprint -- Footprint Area of 8.45 mm2 Low VF Provides Higher Efficiency and Extends Battery Life Supplied in 12 mm Tape and Reel -- 12,000 Units per Reel Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink Powermite is JEDEC Registered as D0-216AA Case: Molded Epoxy Epoxy Meets UL94, VO at 1/8 Weight: 62 mg (approximately) Device Marking: BCJ Lead and Mounting Surface Temperature for Soldering Purposes. 260C Maximum for 10 Seconds Mechanical Characteristics: ORDERING INFORMATION Device MBRM140T3 This document contains information on a new product. Specifications and information herein are subject to change without notice. Package Plastic Shipping 12,000 Units per 12 mm Tape & Reel (c) Semiconductor Components Industries, LLC, 1999 1 October, 1999 - Rev. 2 Publication Order Number: MBRM140T3/D MBRM140T3 MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TC = 110C) Peak Repetitive Forward Current (At Rated VR, Square Wave, 100 kHz, TC = 110C) Non-Repetitive Peak Surge Current (Non-Repetitive peak surge current, halfwave, single phase, 60 Hz) Storage Temperature Operating Junction Temperature Voltage Rate of Change (Rated VR, TJ = 25C) Symbol VRRM VRWM VR IO IFRM IFSM Tstg TJ dv/dt Value 40 Unit V 1.0 2.0 50 -55 to 150 -55 to 125 10,000 A A A C C V/ms THERMAL CHARACTERISTICS Thermal Resistance - Junction-to-Lead (Anode) (1) Thermal Resistance - Junction-to-Tab (Cathode) (1) Thermal Resistance - Junction-to-Ambient (1) Rtjl Rtjtab Rtja 35 23 277 C/W (1) Mounted with minimum recommended pad size, PC Board FR4, See Figures 9 & 10. ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (2), See Figure 2 (IF = 0.1 A) (IF = 1.0 A) (IF = 3.0 A) Maximum Instantaneous Reverse Current, See Figure 4 (VR = 40 V) (VR = 20 V) (2) Pulse Test: Pulse Width 250 s, Duty Cycle 2%. IR VF TJ = 25C 0.36 0.55 0.85 TJ = 25C 0.5 0.15 TJ = 85C 0.30 0.515 0.88 TJ = 85C 25 18 mA V http://onsemi.com 2 MBRM140T3 IF, INSTANTANEOUS FORWARD CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 10 100 10 1.0 TJ = 150C TJ = 85C TJ = 25C TJ = -40C 1.0 TJ = 150C TJ = 85C TJ = 25C 0.1 0.1 0.3 0.5 0.7 0.9 VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 0.1 0.1 0.3 0.5 0.7 0.9 VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage 100E-3 I R, REVERSE CURRENT (AMPS) TJ = 150C TJ = 85C 100E+0 I R, MAXIMUM REVERSE CURRENT (AMPS) 10E+0 1.0E+0 TJ = 150C 10E-3 1.0E-3 100E-3 TJ = 85C 10E-3 1.0E-3 TJ = 25C 100E-6 TJ = 25C 10E-6 100E-6 10E-6 0 10 20 30 40 VR, REVERSE VOLTAGE (VOLTS) 1.0E-6 0 10 20 30 40 VR, REVERSE VOLTAGE (VOLTS) Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current http://onsemi.com 3 MBRM140T3 I O , AVERAGE FORWARD CURRENT (AMPS) dc FREQ = 20 kHz PFO , AVERAGE POWER DISSIPATION (WATTS) 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 25 35 45 55 65 75 85 95 105 115 125 TL, LEAD TEMPERATURE (C) Ipk/Io = 10 Ipk/Io = 20 SQUARE WAVE Ipk/Io = p Ipk/Io = 5 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 IO, AVERAGE FORWARD CURRENT (AMPS) Ipk/Io = 10 Ipk/Io = 20 Ipk/Io = 5 Ipk/Io = p SQUARE WAVE dc Figure 5. Current Derating TJ , DERATED OPERATING TEMPERATURE ( C) 1000 125 Figure 6. Forward Power Dissipation 115 C, CAPACITANCE (pF) TJ = 25C 105 Rtja = 33.72C/W 95 51C/W 69C/W 85 75 0 5.0 10 15 20 25 30 35 40 VR, DC REVERSE VOLTAGE (VOLTS) 83.53C/W 96C/W 100 10 0 5.0 10 15 20 25 30 35 40 VR, REVERSE VOLTAGE (VOLTS) Figure 7. Capacitance Figure 8. Typical Operating Temperature Derating* * Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any reverse voltage conditions. Calculations of TJ therefore must include forward and reverse power effects. The allowable operating TJ = TJmax - r(t)(Pf + Pr) where TJ may be calculated from the equation: r(t) = thermal impedance under given conditions, Pf = forward power dissipation, and Pr = reverse power dissipation This graph displays the derated allowable TJ due to reverse bias under DC conditions only and is calculated as TJ = TJmax - r(t)Pr, where r(t) = Rthja. For other power applications further calculations must be performed. http://onsemi.com 4 MBRM140T3 R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED 1.0 50% 20% 0.1 10% 5.0% 2.0% 1.0% Rtjl(t) = Rtjl*r(t) 0.001 0.00001 0.01 0.0001 0.001 0.01 T, TIME (s) 0.1 1.0 10 100 Figure 9. Thermal Response Junction to Lead R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED) 1.0 50% 20% 0.1 10% 5.0% 0.01 2.0% Rtjl(t) = Rtjl*r(t) 1.0% 0.001 0.00001 0.0001 0.001 0.01 0.1 T, TIME (s) 1.0 10 100 1,000 Figure 10. Thermal Response Junction to Ambient http://onsemi.com 5 MBRM140T3 0.105 2.67 0.025 0.635 0.030 0.762 0.100 2.54 0.050 1.27 inches mm Minimum Recommended Footprint http://onsemi.com 6 MBRM140T3 PACKAGE DIMENSIONS N SUFFIX PLASTIC PACKAGE CASE 457-04 ISSUE C -A- C J S F 0.08 (0.003) M TB S C S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. MILLIMETERS INCHES MIN MAX MIN MAX 1.75 2.05 0.069 0.081 1.75 2.18 0.069 0.086 0.85 1.15 0.033 0.045 0.40 0.69 0.016 0.027 0.70 1.00 0.028 0.039 -0.05 +0.10 -0.002 +0.004 0.10 0.25 0.004 0.010 3.60 3.90 0.142 0.154 0.50 0.80 0.020 0.031 1.20 1.50 0.047 0.059 0.50 REF 0.019 REF TERM. 1 -B- K TERM. 2 R L J H -T- 0.08 (0.003) M DIM A B C D F H J K L R S D TB S C S http://onsemi.com 7 MBRM140T3 POWERMITE is a registered trademark of MicroSemi Corporation ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. PUBLICATION ORDERING INFORMATION USA/EUROPE Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com Fax Response Line*: 303-675-2167 800-344-3810 Toll Free USA/Canada *To receive a Fax of our publications ASIA/PACIFIC: LDC for ON Semiconductor - Asia Support Phone: 303-675-2121 (Tue-Fri 9:00am to 1:00pm, Hong Kong Time) Email: ONlit-asia@hibbertco.com JAPAN: ON Semiconductor, Japan Customer Focus Center 4-32-1 Nishi-Gotanda, Shinagawa-ku, Tokyo, Japan 141-8549 Phone: 81-3-5487-8345 Email: r14153@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. N. America Technical Support: 800-282-9855 Toll Free USA/Canada http://onsemi.com 8 MBRM140T3/D |
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